Thermal Management

Thermal Interface Materials

Thermal Interface Material (TIM)

  • Manufactured using a highly oriented graphite polymeric material which give rise to good thermal conductivity in the X-Y plane
  • More conductive than copper, aluminum or ceramics material
  • High heat resistance up to 400°C

Thermal Interface Material (TIM)

  • TIM are used to improve contact surface area (reduces voids) which improves heat transfer from a surface of higher thermal energy to another surface of lower energy
  • This increases product reliability and lifespan by preventing overheating

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Product Data Sheet

thermal_interface_material

Thermal interface materials (TIMs) are used to transfer heat from a surface of higher thermal energy to another surface of lower surface energy

Such  material  are  commonly  used  to  enable  the  heat  transfer  of  high  power semiconductor devices

Current TIM technologies include thermal greases or pastes, phase change materials, solder paste and thermally conductive adhesive tapes

Presently thermal grease is commonly used in the thermal applications, and most of the products use aluminium or silver powder for better conductivity. Thermal greases are usually oil based and the application is normally messy, making them difficult to apply in a thin, uniform coat. Moreover, in applications that involve high temperatures or extensive thermal cycling, the thermal greases will have the problem of drying out or voids in the surface which will increase the thermal barrier.

With   the   advancement   of   technology,   higher   expectation   of   performance   in semiconductors & electronics will result in more heat generated, thus the need for better thermal dissipation. Our specially-tested thermal interface material is a highly conductive graphite sheet embedded with nano-silver particles to enhance its thermal conductivity to meet up to the changing needs of the semiconductor industries

FEATURES

  • Material Type: Graphite Based
  • Thickness: 0.1 ± 0.03mm
  • Density: 1.0 g/cm³
  • Thermally Conductivity: 600  to 800 W/mK ( More conductive than copper & aluminum)
  • Tensile Modulus: 18 MPa
  • High Heat Resistance: Stable up to 400°C
  • Light Weight
  • Flexible Sheet, easy to cut or trim
  • Options of integration with carbon or silver based adhesive

BENEFITS

  • Thermally Conductive
    More conductive than copper, aluminium or ceramics material
  • Energy Saving
    No electricity used
  • Environmentally Friendly
    Does not use toxic ingredients harmful to the environment
  • Flexible
    Can be easily bent & can be cut to customized sizes
  • Thin & Light Weight
  • Heat Resistant
    Stable up to 450 degree C

AREAS OF APPLICATIONS

  • High Power Semiconductor Devices
  • Laptop, PC & Servers IC Burn-In Testing
  • Mobile Phones & PDAs
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