Thermal Management

Thermal interface materials (TIMs) are used to transfer heat from a surface of higher thermal energy to another surface of lower surface energy

Such  material  are  commonly  used  to  enable  the  heat  transfer  of  high  power semiconductor devices

Current TIM technologies include thermal greases or pastes, phase change materials, solder paste and thermally conductive adhesive tapes

Presently thermal grease is commonly used in the thermal applications, and most of the products use aluminium or silver powder for better conductivity. Thermal greases are usually oil based and the application is normally messy, making them difficult to apply in a thin, uniform coat. Moreover, in applications that involve high temperatures or extensive thermal cycling, the thermal greases will have the problem of drying out or voids in the surface which will increase the thermal barrier.

With   the   advancement   of   technology,   higher   expectation   of   performance   in semiconductors & electronics will result in more heat generated, thus the need for better thermal dissipation. Our specially-tested thermal interface material is a highly conductive graphite sheet embedded with nano-silver particles to enhance its thermal conductivity to meet up to the changing needs of the semiconductor industries