Thermal Management

For more product details, please visit Thermal Management website

Thermal Interface Materials

We provide Thermal Interface Materials with through-plane up to 75W/mK and in-plane up to 1,950W/mK that improves cooling capacity by reducing heat loss

Why Thermal Interface Materials?

With demands of higher processing speed & power in many electronic devices, more heat will be generated, thus the need for better heat dissipation. Removing heat effectively & efficiently is important to maintain the performance & reliability of the electronics devices/modules. Some areas of applications include:
  • Semiconductor devices, e.g. CPU, GPU, MCM, etc.
  • Mobile phones/tablets
  • PCs, servers and cloud storage
  • Batteries for electrical vehicles
  • LED devices
  • IGBT modules
  • Optical communications equipment
  • Medical equipment

About Thermal Interface Material (TIM)

  • Thermal interface material (TIMs) is used in heat transfer between two surfaces (from higher thermal energy to lower thermal energy).
  • Such materials are commonly used to enhance heat transfer for power semiconductor and devices.
  • Current TIM technologies include thermal grease/paste, phase change material, solder paste and thermally conductive adhesive tapes.
  • With the advancing technology, higher expectations on performance from semiconductors and electronics devices causing higher heat generated, thus demanding for better and higher efficiency of heat dissipating material.
  • This increases product reliability and lifespan by preventing overheating of the product

Filling the Gaps

  • Under high magnification, all materials (including glass and metal) have unevenness on the surfaces which will affect the effectiveness of the heat transfer between the heat source & colling medium.
  • TIM are thermally conductive materials that are used to increase thermal conductivity by filling microscopic air-gaps present between 2 surfaces.
  • Selection of correct TIM will increase efficiency of the heat transfer.

 

Presently thermal grease is commonly used in the thermal applications, and most of the products use aluminium or silver powder for better conductivity. Thermal greases are usually oil based and the application is normally messy, making them difficult to apply in a thin, uniform coat. Moreover, in applications that involve high temperatures or extensive thermal cycling, the thermal greases will have the problem of drying out or voids in the surface which will increase the thermal barrier.

With the advancement of technology where semiconductors & electronic modules are getting smaller with increasing speed & power, this will result in more heat generated, thus the need for better thermal dissipation. We are focused on wide range of high performance TIMs which utilizes fillers to improve the thermal efficiency.

Download
Product Data Sheet

TIM-Catalog-Inspiraz-thumb

Our products

Graphite Sheet

TCGS-100
TCGS-220

Carbon Fiber Thermal Pad

CTP-300

Silicone Thermal Pad

STP-400

Phase Change Material

PCM-500

Thermal Gel

TG-600

Low Viscosity Metal

LVM-700

For more product details, please visit Thermal Management website

Thermal Interface Materials

Thermal Interface Material (TIM)

  • Manufactured using a highly oriented graphite polymeric material which give rise to good thermal conductivity in the X-Y plane
  • More conductive than copper, aluminum or ceramics material
  • High heat resistance up to 400°C

Thermal Interface Material (TIM)

  • TIM are used to improve contact surface area (reduces voids) which improves heat transfer from a surface of higher thermal energy to another surface of lower energy
  • This increases product reliability and lifespan by preventing overheating

Download
Product Data Sheet

TIM-Catalog-Inspiraz-thumb

Thermal interface materials (TIMs) are used to transfer heat from a surface of higher thermal energy to another surface of lower surface energy

Such  material  are  commonly  used  to  enable  the  heat  transfer  of  high  power semiconductor devices

Current TIM technologies include thermal greases or pastes, phase change materials, solder paste and thermally conductive adhesive tapes

Presently thermal grease is commonly used in the thermal applications, and most of the products use aluminium or silver powder for better conductivity. Thermal greases are usually oil based and the application is normally messy, making them difficult to apply in a thin, uniform coat. Moreover, in applications that involve high temperatures or extensive thermal cycling, the thermal greases will have the problem of drying out or voids in the surface which will increase the thermal barrier.

With   the   advancement   of   technology,   higher   expectation   of   performance   in semiconductors & electronics will result in more heat generated, thus the need for better thermal dissipation. Our specially-tested thermal interface material is a highly conductive graphite sheet embedded with nano-silver particles to enhance its thermal conductivity to meet up to the changing needs of the semiconductor industries

FEATURES

  • Material Type: Graphite Based
  • Thickness: 0.1 ± 0.03mm
  • Density: 1.0 g/cm³
  • Thermally Conductivity: 600  to 800 W/mK ( More conductive than copper & aluminum)
  • Tensile Modulus: 18 MPa
  • High Heat Resistance: Stable up to 400°C
  • Light Weight
  • Flexible Sheet, easy to cut or trim
  • Options of integration with carbon or silver based adhesive

BENEFITS

  • Thermally Conductive
    More conductive than copper, aluminium or ceramics material
  • Energy Saving
    No electricity used
  • Environmentally Friendly
    Does not use toxic ingredients harmful to the environment
  • Flexible
    Can be easily bent & can be cut to customized sizes
  • Thin & Light Weight
  • Heat Resistant
    Stable up to 450 degree C

AREAS OF APPLICATIONS

  • High Power Semiconductor Devices
  • Laptop, PC & Servers IC Burn-In Testing
  • Mobile Phones & PDAs