Presently thermal grease is commonly used in the thermal applications, and most of the products use aluminium or silver powder for better conductivity. Thermal greases are usually oil based and the application is normally messy, making them difficult to apply in a thin, uniform coat. Moreover, in applications that involve high temperatures or extensive thermal cycling, the thermal greases will have the problem of drying out or voids in the surface which will increase the thermal barrier.
With the advancement of technology where semiconductors & electronic modules are getting smaller with increasing speed & power, this will result in more heat generated, thus the need for better thermal dissipation. We are focused on wide range of high performance TIMs which utilizes fillers to improve the thermal efficiency.
TCGS-100
TCGS-220
CTP-300
STP-400
PCM-500
TG-600
LVM-700
Thermal Interface Material (TIM)
Thermal Interface Material (TIM)
Thermal interface materials (TIMs) are used to transfer heat from a surface of higher thermal energy to another surface of lower surface energy
Such material are commonly used to enable the heat transfer of high power semiconductor devices
Current TIM technologies include thermal greases or pastes, phase change materials, solder paste and thermally conductive adhesive tapes
Presently thermal grease is commonly used in the thermal applications, and most of the products use aluminium or silver powder for better conductivity. Thermal greases are usually oil based and the application is normally messy, making them difficult to apply in a thin, uniform coat. Moreover, in applications that involve high temperatures or extensive thermal cycling, the thermal greases will have the problem of drying out or voids in the surface which will increase the thermal barrier.
With the advancement of technology, higher expectation of performance in semiconductors & electronics will result in more heat generated, thus the need for better thermal dissipation. Our specially-tested thermal interface material is a highly conductive graphite sheet embedded with nano-silver particles to enhance its thermal conductivity to meet up to the changing needs of the semiconductor industries