Advanced Packaging Solution

Clean Pad

For probe pin cleaning through the unique adhesive coating, could bear a wide range of temperatures and improve the yield during the probing process, suitable for any probe pin type, especially crown type.

Key Benefits:

Low wear out rate for test probe tip
Increased life span for test socket/probe card
Maintaining 1st pass yield
Increased up-time for test equipment
Reduced cost of ownership

Test Results – CF-900 vs Brand “M”

A quad-site test was carried out for 4 lots of QFN devices, of which site 0 & 4 is using Brand “M”, and Site 1 & 2 is using CF-900
Test yield for CF-900 on Site 1 & 2 is higher than Brand “M”

Balanced Film

For warpage control through special lamination method also could bear high temperatures and harsh chemical reactions during the process.

Warpage Control
Thermal Stability
Wide Applicability
Chemical Resistance

Fan-Out Process

We serve an international customer base through a global network of distribution and integration partners to end-user manufacturers, original equipment manufacturers, and manufacturing machine builders, in a wide variety of manufacturing markets including electronics, automotive, medical device, pharmaceutical, food & beverage, printing, plastic and packaged goods industries.

For Sales Inquiry
[email protected]

Corporate Headquarter
Blk 21, Kallang Avenue, #06-173/175
Singapore 339412
Tel : +65 62970880

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